The expanded in-house wire bonding and die attach suite now includes Hesse Bondjet BJ855 and BJ820 automated wire bonders, Westbond 7KE/7KEH and 7476E/747630E manual wedge, ball, and ribbon bond ...

EnSilica, an Oxford headquartered chip maker of mixed signal ASICs (Application Specific Integrated Circuits), has established a new engineering hub at The Bradfield Centre on Cambridge Science Park.

Approximately $30 million investment through AIDRFIC program will fund projects led by Keysight, Princeton University, and University of Texas at Austin ...

The U.S. has ordered companies that offer software used to design semiconductors to stop selling to China without first ...

NASHUA, NH – Amphenol Printed Circuits will be offering a small but impressive sample of its vast design, manufacturing, and test capabilities in Radio Frequency (RF) printed circuit boards (PCBs) ...

Thermal design has become a first-order constraint in GaN system performance. As GaN pushes deeper into high-power, ...

EnSilica, a maker of mixed signal ASICs, has announced that it has established a new engineering hub in Cambridge, UK.

EnSilica, the mixed-signal ASIC specialist,  has established a new engineering hub in Cambridge and has recruited six engineers, four of whom hold PhDs, ...

Superconductivity is an advantageous property observed in some materials, which entails an electrical resistance of zero at ...

GlobalFoundries is looking for a highly motivated Engineer in RF circuit design to work in the Reference design team based in ...

Abstract: A new design methodology for radiofrequency circuits ... from the Pareto front and their S-parameter matrix is included in the circuit netlist that is simulated using an RF simulator.

Semiconductor EDA software enables the engineers to create, test, and validate circuits in virtual environments before any ...