Abstract: This work proposes a method to estimate the heat dissipation of components that are centrally soldered to printed circuit boards (PCBs). The power losses of a ball grid array (BGA) package ...

Abstract: An efficient microwave network method is proposed for signal and power integrity analysis of a multilayer printed circuit board with multiple vias and decoupling capacitors. The multilayer ...

Asahi Kasei has developed the Sunfort TA series of dry film photoresist for next-gen semiconductor packages requiring fine ...

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Kalesh Sasidharan] from Sciotronics wrote in to tell us about their project, Stamp: a modular set of template breakout boards designed to make prototyping with SMD components faster, easier, and ...

We present a novel microfluidic device based on the integration of printed circuit boards and an isotachophoresis assay for sample preparation of nucleic acids from biological samples. The device has ...