Prof. Peter O’Brien, Head of the Photonics Packaging Group at Tyndall, said: "We’re delighted to bring our expertise in advanced packaging to the EPIQUE Project. This is an exciting step forward for ...

Heterogeneous integration — an umbrella term that covers many different applications and packaging requirements — holds the ...

The Cold War was a fertile period for designing and manufacturing new military tanks, and some companies really took big liberties with accepted design trends.

Computex 2025 is one for the history books — showing us the future of AI, PC hardware, gaming and home office gear. With roughly 250 new pieces of tech unveiled, it’s easy to get lost in it all, so we ...

CEA-Leti stated, “As the demand for innovative and interactive displays continues to grow, microLED technology has emerged as a promising contender for future display applications due to its ...