The explosive growth of artificial intelligence (AI) has created an unprecedented demand for computational power. As the chip ...

The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding the first finalized agreement to allocate incentives under the ...

Several critical processes address wafer flatness, wafer edge defects and what's needed to enable bonded wafer stacks.

The Biden administration has finalized its first binding award under the Chips and Science Act: a $123 million grant to Polar ...

The U.S. Commerce Department said on Tuesday it had finalized a $123 million grant for Polar Semiconductor to expand its ...

3D IC), Package Type (BGA, SOP), Packaging Method (Flip Chip, Wire Bond), Device (RF Front-End, RF Amplifier), Application ...

Chiplet-based products must accommodate small differences in die size and bump pitch, placing new demands on manufacturing ...

A Finish fabless firm teams up with a French ASIC service provider to produce an ultra-compact RF front-end module.

Even as global efforts are made to create policies, new plants and marketplaces for semiconductors, unpredictable demand and continued talent shortages cast doubt on what the future will bring.

More than 85% of the 37 chips used in it were locally manufactured, including the advanced 7 nanometre (nm) chip. The Biden administration wondered how China had managed to produce the advanced ...