Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S.

The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of ...

Nvidia CEO Jensen Huang confirms changes in advanced packaging needs at TSMC, opting for CoWoS-L over CoWoS-S for upcoming ...

Analyst Charles Shi reiterates a Buy rating for Taiwan Semiconductor with $225 price target. Company expects AI revenue to double in 2025.

TAICHUNG, Taiwan (Reuters) -- Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on ...

The Commerce Department has awarded $1.2 billion to two ASU-related projects and facilities tied to the way semiconductors ...

The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of ...

Nvidia continues to enhance its packaging technology with TSMC, shifting from CoWoS-S to CoWoS-L for its AI chips. The ...

Nvidia's most sophisticated AI chip, named Blackwell, is composed of several chips merged using a complex chip on wafer on ...

Micron Technology initiated construction on (January 8, 2025) of a new High-Bandwidth Memory (HBM) advanced packaging ...

Taiwan has taken another step in enhancing its key role in the production of advanced semiconductor chips used for artificial intelligence with the inauguration of a new plant by Siliconware Precision ...