Traditionally, multi-chip module (MCM) flip chip ball grid array (FCBGA) packaging has been used for heterogeneous interfaces of multi-chips on laminate substrates. However, this approach falls short ...
There are many different IC package types. Examples include ball-grid array (BGA), flip chip ball-grid array (FCBGA), plastic ball-grid array (PBGA), multi-chip module plastic ball-grid array ...
FCBGA Flip chip ball-grid array (FCBGA) uses a combination of flip chip and ball grid array features. FCBGA enables short electrical paths for high frequency applications. The simultaneous soldering ...
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