Discover how in circuit test advancements drive quality, speed, and efficiency in high-volume PCB manufacturing.

In today’s fast-paced electronics industry, where innovation, efficiency, and reliability are essential, finding the right ...

HDI technically means high-density interconnect, and practically means that we’re able to design with smaller clearances and ...

In its seventh year, Design World’s LEAP Awards showcase the best engineering innovations across several design categories.

Due to logistical considerations and security concerns, the PCB has planned all of India's matches in Lahore. The city's proximity to the border makes it easier for Indian fans to attend the games ...

Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass ...

The number of layers for the PCB was decided based on the board component density ... These signals are routed with two vias, one near VX700 for BGA escaping, and the other near the memory BGA pads.

The Trenz Electronic AXE5-EAGLE-ES devkit (development kit) is powered by an Intel Agilex 5 E-series SoC FPGA, codenamed Sundance Mesa. It is designed for FPGA applications in sectors such as wireless ...

Data supplied by Morningstar and accurate on Jun 30, 2024. It's not possible to publish a real-time Top 20 Shareholder list. Companies are not obliged to report this data (with the exception of ...

[Ayilm1] has brought back the brightness with a clever BGA reworking hack that gains access ... wire is run from that to the other side of the PCB where lies its destination.

First he applies a generous layer of liquid solder flux to the BGA footprint on the board. Next he melts some solder onto the tip of his iron and uses it to tin all of the board’s BGA pads.