HDI technically means high-density interconnect, and practically means that we’re able to design with smaller clearances and ...

Discover how in circuit test advancements drive quality, speed, and efficiency in high-volume PCB manufacturing.

In its seventh year, Design World’s LEAP Awards showcase the best engineering innovations across several design categories.

With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important to make solid contact with the Printed Circuit Board (PCB).

The number of layers for the PCB was decided based on the board component density ... These signals are routed with two vias, one near VX700 for BGA escaping, and the other near the memory BGA pads.

We believe the robust demand for MLCCs, mainly from smartphone and automotive manufacturers, will be the driver of Semco’s growth in the midterm. Over the past decade, the growth of passive components ...

BGA workstation, Protoflow S Reflow oven, Protoprint Zeliflex QR MT Solder Paste Printer, Protoplace S, semi-automatic pic and place, TruView X-Ray, Voltera V-one PCB printer, Lynx EVO Eyepiece-less ...

Due to logistical considerations and security concerns, the PCB has planned all of India's matches in Lahore. The city's proximity to the border makes it easier for Indian fans to attend the games ...

In today’s fast-paced electronics industry, where innovation, efficiency, and reliability are essential, finding the right ...