package types are the most important specifications to consider when selecting IC package converters and adapters. Choices include: Ball-grid array (BGA), land-grid array (LGA), pin grid array (PGA), ...

New versions of the IC are still being cranked out ... a 555 in a chip-sized BGA (ball-grid-array) package. This part is smaller than two 0603 resistors side-by-side. While dead-bugging the ...

Bonding Die bonding is the attachment of IC chips or dies using an adhesive into a package. Back Grinding Thinning of dies or chips using back grinding processes to improve thermal dissipation and ...

Japanese IC substrate manufacturer Ibiden has lowered its overall performance forecast for the fiscal year 2024 (April 2024 ...

Infineon Technologies is launching the new MOTIX™ TLE9189 gate driver IC for safety-critical applications for 12 V brushless ...

With this in mind, let’s look at what’s typically included in a severance package. What is a severance package? A severance package is the pay and benefits an employee receives from an ...

We also sell both admissions and sponsorship packages for our investment conferences and advertising on our websites and newsletters. Maintaining independence and editorial freedom is essential to ...

With the introduction of this new three-phase gate driver IC, Infineon aims to address the increasing demand for motor ...

Blower-mode noise is based on industry-standard measurements at 50 feet and our measurements at ear level. Models rated Very Good or Excellent at 50 feet should meet common municipal limits of 65 ...

In a report released today, Brad Lin from Bank of America Securities reiterated a Buy rating on ASE Technology Holding Co (ASX – Research ...

One area that often gets overlooked is the psychology of product packaging, especially during a rebrand. Navigating the landscape of product development and marketing can be complex. Amidst the ...

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