Like all modern PCBs, the Mac Mini storage chip is a surface-mount component that uses a ball grid array (BGA), which is much ...

In a report released today, Brad Lin from Bank of America Securities reiterated a Buy rating on ASE Technology Holding Co (ASX – Research ...

Japanese IC substrate manufacturer Ibiden has lowered its overall performance forecast for the fiscal year 2024 (April 2024 ...

We believe the robust demand for MLCCs, mainly from smartphone and automotive manufacturers, will be the driver of Semco’s growth in the midterm. Over the past decade, the growth of passive components ...

ISE Labs, a subsidiary of ASE Technology, has acquired land in Tonalá, Jalisco, to establish a semiconductor packaging and ...

In its seventh year, Design World’s LEAP Awards showcase the best engineering innovations across several design categories.

Der Intel Celeron N5100 ist ein Anfang 2021 vorgestellter Quad-Core-SoC, der hauptsächlich in preiswerten und kleinen Desktops verbaut wird. Er taktet mit 2 bis 2,9 GHz (Einzelkern Burst) und gehört d ...

Introduction : Growth in Use of BGA Packages for FPGAs In recent years ... Figure 1: Typical Ball Grid Array Package (from Chip Scale Review) The top-down view of a high density package is shown in ...

The memory chip placements and the bus topologies are described in subsequent ... These signals are routed with two vias, one near VX700 for BGA escaping, and the other near the memory BGA pads. The ...

* Klingbeil: Vorschläge sind immer willkommen * FDP macht Druck: Lindner-Konzept muss Realität werden * Merz sieht Übereinstimmungen Union/FDP * Wirtschaft lobt Lindner-Vorschläge: Schritt nach vorne ...

AMD is said to unveil multiple CPU designs during CES 2025, alongside new gaming handheld chips and Radeon 8000 GPUs.