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Avago claims its WaferCap is the industry's first wafer-level chip-scale packaging (CSP) technology, squeezing RF chips into a 1-by-.5-by.25 millimeter leadless “0402”-size package, more familiar as ...
Moreover, RF-optimized packaging products and processes are essential to enabling ... A flexible assembly processes can accommodate bonding of multiple components, including dies, passive SMT ...
TOKYO, JAPAN--(Marketwired - Jun 14, 2016) - Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has installed its 800th V93000 Port Scale RF test system, with the ...
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